汇丰银行-亚洲-半导体行业-亚洲科技：3D传感对于epi晶片制造商的意义-2018.1.29-22页

Disclosures&DisclaimerThisreportmustbereadwiththedisclosuresandtheanalystcertificationsintheDisclosureappendix,andwiththeDisclaimer,whichformspartofit.Issuerofreport:HSBCSecurities(Taiwan)CorporationLimitedViewHSBCGlobalResearchat:https://www.research.hsbc.comMiFIDII–ResearchIsyouraccessagreed?CONTACTustoday??????Adoptionof3Dsensingtoriserapidlyinmanyapplications,suchassmartphones,self-drivingcarsandindustryautomation?Smartphoneisthekeydriverin2018-19andepi-wafervendorsshouldbenefitfromoutsourcingpartnershipswithIDMs?Epi-waferplayersinTaiwanareVPEC,HLJandLandMark(Buy)3Dsensingdemandtogrowthrapidlydriveninitiallybysmartphoneadoptionandlaterbynewareas,suchasVR/AR,autonomousdriving(e.g.LiDAR)andindustryautomation.Taiwanepi-wafermakersstandtobenefitfrom(1)outsourcingdemandfromaleadingIDMand(2)structural